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LH1514AB/AAC/AACTR 2 Form A Solid State Relay High Frequency FEATURES * * * * * * * * * * * * Load Voltage, 15 V Load Current, 150 mA Switching Capability up to 50 MHz Blocking Capability Dependent upon Signal dv/dt Low and Typical RON 5.0 1.0 ms Actuation Time Low Power Consumption 3750 VRMS I/O Isolation Balanced Switching Linear AC/DC Operation Clean, Bounce-free Switching Surface-mountable Package Dimensions in Inches (mm) DIP pin one ID 4 .268 (6.81) .255 (6.48) 5 6 7 8 1 2 3 4 3 2 1 S1 8 S1' 7 S2 6 S2' 5 S1 S2 S1' S2' .390 (9.91) .379 (9.63) .045 (1.14) .030 (0.76) 4 typ. .031 (0.79) .300 (7.62) typ. .150 (3.81) .130 (3.30) .050 (1.27) .022 (.56) .018 (.46) .035 (.89) .020 (.51) .100 (2.54) typ. 10 3-9 .012 (.30) .008 (.20) .130 (3.30) .110 (2.79) .250 (6.35) .230 (5.84) AGENCY APPROVALS * UL - File No. E52744 * CSA - Certification 093751 * VDE 0884 Approval APPLICATIONS * Protection Switching (T1 sparing) - Digital Access Cross Connects - D-type Channel Breaks - Intraoffice Data Routing * Transmission Switching - T1 Multiplexing - DSO (64 Kbits/s) - DS1 (1.544 Mbits/s) - E1, DS1A (2.048 Mbits/s) - DS1C (3.152 Mbits/s) - DS2 (6.312 Mbits/s) * Instrumentation - Scanners - Testers - Measurement Equipment * See Application Note Part Identification Part Number LH1514AB LH1514AAC LH1514AACTR Description 8-pin DIP, Tubes 8-pin SMD, Gullwing, Tubes 8-pin SMD, Gullwing, Tape and Reel SMD Pin one I.D. .268 (6.81) .255 (6.48) .390 (9.91) .379 (9.63) .031 (.79) typ. .150 (3.81) .130 (3.30) .395 (10.03) .375 (9.52) .312 (7.80) .298 (7.52) 3 to 7 .045 (1.14) .030 (0.78) Radius 4 typ. .050 (1.27) typ. .008 (.25) .004 (.10) .040 (1.02) .020 (.51) .100 (2.54) typ. 10 .315 (8.00) typ. .010 (2.54) typ. DESCRIPTION The LH1514 is a DPST normally open (2 Form A) SSR that can be used in balanced high-frequency applications like T1 switching. With its low ON-resistance and high actuation rate, the LH1514 is also very attractive as a general-purpose 2 Form A SSR for balanced signals. The relays are constructed using a GaAlAs LED for actuation control and an integrated monolithic die for the switch output. The die, fabricated in a dielectrically isolated Smart Power BiCMOS, is comprised of a photodiode array, switch control circuitry, and NMOS switches. In balanced switching applications, internal circuitry shunts high-frequency signals between two poles when the SSR is off. This balanced T termination technique provides high isolation for the load. Document Number: 83814 Revision 17-August-01 www.vishay.com 3-72 Recommended Operating Conditions Parameter LED Forward Current for Switch Turn-on (TA=-40C to +85C) Sym. Min. 10 Typ. -- Max. Unit 20 mA Absolute Maximum Ratings, TA=25C Stresses in excess of the Absolute Maximum Ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of the data sheet. Exposure to maximum rating conditions for extended periods can adversely affect device reliability. IFon Ambient Operating Temperature Range, TA .................. -40 to +85C Storage Temperature Range, Tstg ................................ -40 to +150C Pin Soldering Temperature, t=10 s max, TS ................................ 260C Input/Output Isolation Voltage, VISO .....................................3750 VRMS LED Input Ratings: Continuous Forward Current, IF...............................................50 mA Reverse Voltage, IR10 A, VR ...................................................10 V Output Operation: dc or Peak ac Load Voltage, IL1.0 A, VL ................................15 V Continuous dc Load Current, IL Each Pole, Two Poles Operating Simultaneously .................150 mA Power Dissipation, PDISS ..........................................................600 mW Electrical Characteristics, TA=25C Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluations. Typical values are for information purposes only and are not part of the testing requirements. Parameter LED Forward Current, Switch Turn-on LED Forward Current, Switch Turn-off LED Forward Voltage ON-resistance Pole-to-pole ON-resistance Matching (S1 to S2) Output Off-state Bleed-through* Symbol Min. -- 0.2 1.15 2.0 -- Typ. 2.0 1.8 1.26 3.0 0.2 70 Max. 5.0 -- 1.45 5.0 1.0 100 Unit mA mA V D mVpeak Test Condition IFon IFoff VF RON -- -- IL=100 mA, t=10 ms VL=10 V IF=10 mA IF=10 mA, IL=50 mA IF=10 mA, IL=50 mA f=1.5 MHz square wave tr/tf=5.0 ns (See Figure 13.) -- Output Off-state Leakage Output Off-state Leakage Pole to Pole -- -- -- -- 3x10-12 200x10-9 A 20x10-12 1.0x10-6 A 1.0 5.0 A IF=0 mA, VL=5.0 V VL=15 V IF=10 mA Pins 7, 8 3.0 V Pins 5, 6 Gnd Pins 7, 8 15 V Pins 5, 6 Gnd -- Output Capacitance Pins 5 to 6, 7 to 8 Pole-to-pole Capacitance (S1 to S2) Turn-on Time Turn-off Time -- -- 2.0 20 20 50 0.4 0.6 50 -- -- -- 1.0 1.0 A pF pF pF ms ms -- -- -- IF=0 mA, VL=0 IF=0 mA, VL=0 V IF=10 mA, VL=0 V IF=10 mA, IL=20 mA IF=10 mA, IL=20 mA ton toff -- -- * Guaranteed by component measurement during wafer probe. Document Number: 83814 Revision 17-August-01 www.vishay.com 3-73 Typical Performance Characteristics Figure 1. LED Forward Current for Switch Turn-on/off 4.0 LED Forward Current (mA) 3.5 3.0 2.5 2.0 1.5 20 1.0 0.5 -40 0 -20 0 20 40 60 80 10 15 20 25 30 Ambient Temperature (C) Breakdown Voltage (V) % 60 IL=100 mA 80 Figure 4. Breakdown Voltage Distribution Typical 100 n=180 40 Figure 2. Leakage Current vs. Applied Voltage 25 Figure 5. Output Isolation 100 VP=10 V RL=50 80 Isolation (dB) Leakage Current (pA) 20 15 60 10 40 5 20 0 105 0 0 4 8 12 16 20 Applied Voltage (V) 106 107 108 Frequency (Hz) Figure 3. ON-Resistance vs. Temperature 8 Change in On-resistance (%) Normalized to 25C 6 Figure 6. Insertion Loss (per Pole) vs. Frequency 0.5 0.4 Insertion Loss (dB) 4 2 0 -2 -4 -6 -40 RL=90 0.3 0.2 0.1 -20 0 20 40 60 80 0 10 2 10 4 106 108 Ambient Temperature (C) Frequency (Hz) Document Number: 83814 Revision 17-August-01 www.vishay.com 3-74 Figure 7. ton vs. LED Forward Current 10 IL=20 mA 8 85C 6 25C 4 -40C 2 Figure 9. ton/toff vs. Temperature 1.1 toff 1.0 Turn-on/off Time (ms) 0.9 0.8 0.7 0.6 0.5 0.4 ton Turn-on Time (ms) 0 0 10 20 30 40 50 LED Forward Current (mA) 0.3 -40 -20 0 20 40 60 80 Ambient Temperature (C) Figure 8. Bleed-through Voltage vs. Rise Time 100 Peak Bleedthrough Voltage (mV) Figure 10. toff vs. LED Forward Current 1.2 IL=20 mA 1.0 Turn-off Time (ms) -40C 80 60 0.8 25C 0.6 85C 0.4 40 20 0 0 5 10 15 20 25 30 Rise Time (ns) 0.2 0 10 20 30 40 50 LED Forward Current (mA) Document Number: 83814 Revision 17-August-01 www.vishay.com 3-75 Functional Description Figure 12 shows the switch characteristics of the relay. The relay exhibits an ON-resistance that is exceptionally linear up to the knee current (IK). Beyond IK, the incremental resistance decreases, minimizing internal power dissipation. In a 2 Form A relay, to turn the relay on, forward current is applied to the LED. The amount of current applied determines the amount of light produced for the photodiode array. This photodiode array develops a drive voltage for both NMOS switch outputs. For high-temperature or high-load current operations, more LED current is required. For high-frequency applications, the LH1514 must be wired as shown in the Figure 15 application diagram to minimize transmission crosstalk and bleed-through. A single LH1514 package switches a single transmit twisted pair or a single receive twisted pair. In this configuration when the SSR is turned off, the SSR parries high-frequency signals by shunting them through the SSR, thereby isolating the transformer load. When switching alternate mark inversion (AMI) coding transmission, the most critical SSR parameter is dv/dt bleedthrough. This bleed-through is a result of the rise and fall time slew rates of the 3.0 V AMI pulses. The test circuit in Figure 13 illustrates these bleed-through glitches. It is important to recognize that the transmission limitations of the LH1514 are bleed-through related and not frequency related. The maximum frequency the LH1514 SSR can switch will be determined by the pulse rise and fall times and the sensitivity of the receive electronics to the resultant bleed-through. At data rates above 2.0 Mbits/s, the 50 pF pole-to-pole capacitance of the LH1514 should be considered when analyzing the load match to the transmission line. Please refer to the T1 Switching with the LH1514 SSR Application Note for further information on load-matching and off-state blocking. Test Circuit Figure 13. Off-state Bleed-through tr 5.0 ns Figure 11. Pin Diagram and Pin Outs CONTROL + CONTROL + CONTROL- BLANK 1 2 8 7 S1 S1' S2 S2' DPST 3 4 6 5 Figure 12. Typical ON Characteristics +I 150 mA IL(max) 4.0 IK 5.0 -0.3 V -V IK 0.3 V -60 mA +V 60 mA IL(max) -150 mA -I tf 5.0 ns NC NC 3.0 V NC 1 2 3 4 8 7 50 * 6 5 100 mV max 100 mV max f = 1.5 MHz NC * 50 load is derived from T1 applications where a 100 load is paralleled with a 100 line. Document Number: 83814 Revision 17-August-01 www.vishay.com 3-76 Applications Figure 14. Protection Switching Application: T1 Interface Operating; Spare in Test Loopback Mode T1 INTERFACE 1 INTERFACE SPARE LH1514 LH1514 LH1514 LH1514 LH1514 LH1514 INTERFACE 2 (ETC.) LH1514 LH1514 LH1514 T1 LINE 1 Figure 15. T1 Multiplexer Receive Data (Interface 1, Operating) Features LH1514 1:2 100 Z0 164 800 INTERFACE 1 90 LH1514 1:2 164 RECEIVE DATA LINE INTERFACE 800 INTERFACE 2 Document Number: 83814 Revision 17-August-01 www.vishay.com 3-77 |
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